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RF51883V 1950 MHz WCDMA Linear Power Amplifier Module
RF5188
3V 1950MHZ W-CDMA LINEAR POWER AMPLIFIER MODULE
RoHS Compliant & Pb-Free Product Package Style: QFN, 16-Pin, 3 x 3
]
VCCBIAS
Input/Output Internally Matched@50 27.5dBm Linear Output Power 42% Peak Linear Efficiency 28dB Linear Gain -42dBc ACLR @ 5MHz HSDPA Capable
RF IN 1 GND 2 VMODE 3
16
15
14
13
NC
IM
Features
VCC1/IM
12 VCC2 11 VCC2 10 VCC2 Bias 9 RF OUT
VREG 4
Applications
3V W-CDMA Band 1 Handsets Multi-Mode W-CDMA 3G Handsets 3V TD-SCDMA Handsets Spread-Spectrum Systems
5 NC
6 NC
7 NC
8 NC
Functional Block Diagram
Product Description
The RF5188 is a high-power, high-efficiency linear amplifier module specifically designed for 3V handheld systems. The device is manufactured on an advanced third generation GaAs HBT process, and was designed for use as the final RF amplifier in 3V W-CDMA handheld digital cellular equipment, spread-spectrum systems, and other applications in the 1920MHz to 1980MHz band (Band 1). The RF5188 has a digital control line for low power applications to lower quiescent current. The RF5188 is assembled in at 16-pin, 3mmx3mm, QFN package.
Ordering Information
RF5188 RF5188PCBA-41X 3V 1950MHz W-CDMA Linear Power Amplifier Module Fully Assembled Evaluation Board
Optimum Technology Matching(R) Applied
GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT
RF MICRO DEVICES(R), RFMD(R), Optimum Technology Matching(R), Enabling Wireless ConnectivityTM, PowerStar(R), POLARISTM TOTAL RADIOTM and UltimateBlueTM are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. (c)2006, RF Micro Devices, Inc.
Rev A4 DS060310
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF5188
Absolute Maximum Ratings Parameter
Supply Voltage (RF off) Supply Voltage (POUT 31dBm) Control Voltage (VREG) Input RF Power Mode Voltage (VMODE) Operating Temperature Storage Temperature Moisture Sensitivity Level (IPC/JEDEC J-STD-20)
Rating
+8.0 +5.2 +3.9 +10 +3.9 -30 to +110 -40 to +150 MSL 2 @ 260
Unit
V V V dBm V C C C
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Parameter
Min.
Specification Typ.
Max.
Unit
Condition
T=25oC Ambient, VCCBIAS =3.4V, VCC =3.4V, VREG =2.8V, VMODE =0V, and POUT =27.5dBm for all parameters (unless otherwise specified). Modulation is 3GPP 3.2 0300 DPCCH+1DPDCH.
High Gain Mode (VMODE Low)
Operating Frequency Range Linear Gain Harmonics Maximum Linear Output Linear Efficiency Maximum ICC ACLR1 @ 5MHz ACLR2 @ 10MHz Input VSWR Output VSWR Stability Ruggedness Noise Power
1920 26 27.5 38 352 42 394 -42 -53 1.7:1 28.5
1980 32 -10 47 435 -37 -48 6:1 10:1 -150 -133 -140 -143 -147 -107
MHz dB dBm dBm % mA dBc dBc No oscillation>-70dBc No damage dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm/Hz dBm/Hz -50IM Products IM 5MHz IM 10MHz -31 -41 dBc dBc
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7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A4 DS060310
RF5188
Parameter Min. Specification Typ. Max. Unit Condition
T=25oC Ambient, VCCBIAS =3.4V, VCC =1.5V, VREG =2.8V, VMODE =2.8V, and POUT =16dBm for all parameters (unless otherwise specified). Modulation is 3GPP 3.2 03-00 DPCCH+1DPDCH. 1920 22 16 18.3 21.0 -41 -54 105 125 2:1 6:1 10:1 IM Products IM 5MHz IM 10MHz -31 -41 3.2 0.6 VCC Bias High Gain Idle Current (ICC1 /ICC2 /ICCBIAS) Low Gain Idle Current (ICC1 /ICC2 /ICCBIAS) VREG Current VMODE Current RF Turn On/Off Time DC Turn On/Off Time Total Current (Power Down) VREG Low Voltage (Power Down) VREG High Voltage (Recommended) VREG High Voltage (Operational) VMODE Voltage VMODE Voltage 0 2.75 2.7 0 2.0 2.8 1.5 70 60 1 250 1.2 2 0.2 6 25 0.5 0.5 2.95 3.0 0.5 3.0 4.2 93 83 3 3.4 4.2 dBc dBc V V V mA mA mA uA uS uS uA V V V V V High Gain Mode Low Gain Mode VMODE =low and VREG =2.8V, VCC =3.4V VMODE =high and VREG =2.8V, VCC =1.5V Low power with DC to DC Converter IF offset fO +5MHz with CW signal=-40dBc IF offset fO +10MHz with CW signal=-40dBc No oscillation>-65dBc No damage 25.3 -37 -48 145 26 1980 31 MHz dB dBm % dBc dBc mA
Low Gain Mode (VMODE High)
Operating Frequency Range Linear Gain Maximum Linear Output Linear Efficiency ACLR @ 5MHz ACLR @ 10MHz Maximum ICC Input VSWR Output VSWR Stability Ruggedness
Power Supply
Supply Voltage (VCC1 and VCC2)
Rev A4 DS060310
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF5188
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pkg Base Function RF IN GND VMODE VREG NC NC NC NC RF OUT VCC2 VCC2 VCC2 NC IM VCC1/IM VCCBIAS GND Description
RF input internally matched to 50. This input is internally AC-coupled. Ground connection. For nominal operation (High Power mode), VMODE is set LOW. When set HIGH, devices are biased lower to improve efficiency at lower output levels. Regulated voltage supply for amplifier bias circuit. In power down mode, both VREG and VMODE need to be LOW (<0.5V). No connection. Do not connect this pin to any external circuit. No connection. Do not connect this pin to any external circuit. No connection. Do not connect this pin to any external circuit. No connection. Do not connect this pin to any external circuit. RF output. Internally AC-coupled. Output stage collector supply. Please see the schematic for required external components. Same as pin 10. Same as pin 10. No connection. Do not connect this pin to any external circuit. Interstage matching. Connect to pin 15. First stage collector supply and interstage matching. A 4.7F decoupling capacitor may be required. Connect to pin 14. Power supply input for the DC bias circuitry. Ground connection. The backside of the package should be soldered to a top side ground pad which is connected to the ground plane with multiple vias. The pad should have a short thermal path to the ground plane.
Interface Schematic
Package Drawing
3.00
Pin 1 ID
A
1.45
Pin 1 ID
3.00
1.45
0.28 TYP 0.18 0.05
0.15 C
2 PLCS
B
0.15 C
2 PLCS
0.40 TYP 0.20
0.10 M C A B
0.50 TYP
0.203 REF
0.08 C 0.08 C
0.925 0.775
Shaded areas represent pin 1.
0.102 REF
Dimensions in mm.
C
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7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A4 DS060310
RF5188
Application Schematic
VCC BIAS L2 1 nF 10 ? F VCC
16
15
14
13
RF IN
1 2
12 11 10 Bias 9 RF OUT Matching Component 1 nF Place this component next to RF5188 with minimal trace length to the PA.
VMODE 1 nF 3 4 VREG 1 nF 5 6 7 8
VCC BIAS can be connected to VCC; however, VCC must be maintained above 1.5 V. L2 = 8.2 nH and may be needed to provide isolation between VCC1 and VCC2 depending on layout.
Circuit Optimization for Various Output Power Requirements
Output Power (dBm) 28 27.5 26.5 26 25 Matching Component 12nH N/A 0.5pF 1.0pF 1.5pF GRM1555C1HR50BZ01E (Murata) GRM1555C1H1R0BZ01E (Murata) GRM1555C1H1R5BZ01E (Murata) Sample Part Number LQG15HN12NJ02D (Murata) Typical Efficiency (%) 41 42 42 42 41
Rev A4 DS060310
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF5188
Evaluation Board Schematic
VCCBIAS VCC1
R1 0
C30 4.7 F
R2 DNI C3 1 nF 16 J1 RF IN 50 strip 15 L2 DNI 14 13
1 2
12 11 10 Bias 9 C1 1 nF 50 strip C10 22 F VCC2
VMODE C20 4.7 F VREG C40 4.7 F C2 1 nF P1 P1-1 P1-2 1 2 3 4 5 CON5 VMODE VRE G GND GND GND P2-3 P2-4 P2-1 5 6 7 8 P2 1 2 3 4 5 CON5 VCC2 GND VCC1 VCCBIAS GND 3 4
J2 RF OUT
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7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A4 DS060310
RF5188
PCB Design Requirements
PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern
A = 0.64 x 0.28 (mm) Typ. B = 0.28 x 0.64 (mm) Typ. C = 0.78 x 0.64 (mm) D = 0.64 x 1.28 (mm) E = 1.50 (mm) Sq.
Dimensions in mm.
Pin 16 Pin 1
0.75 Typ. B
1.50 Typ.
C
B
0.50 Typ.
A A A A B B B B
Pin 8
E
D A 0.75 Typ.
1.00 Typ.
0.55 Typ. 0.55 Typ.
0.75 Typ.
Figure 1. PCB Metal Land Pattern (Top View)
Rev A4 DS060310
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
7 of 8
RF5188
PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 0.74 x 0.38 (mm) Typ. B = 0.38 x 0.74 (mm) Typ. C = 1.60 (mm) Sq.
Dimensions in mm.
0.50 Typ.
Pin 16 Pin 1
1.50 Typ.
BBBB A A A A A A A A
Pin 8
Pin 12
0.50 Typ.
C
0.75 Typ.
1.50 Typ.
0.55 Typ. 0.55 Typ.
BBBB
0.75 Typ.
Figure 2. PCB Solder Mask Pattern (Top View) Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
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7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A4 DS060310

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